1
Stable Colloidal Silica Dispersion： Uniform particle distribution contributes to stable polishing performance and helps reduce particle agglomeration during processing.
2
Reduced Dishing and Erosion：Advanced semiconductor devices require increasingly stringent topography control. Optimized slurry formulations help minimize dishing and erosion and contribute to improved planarization performance.
3
Lower Post-CMP Particle Defects：Particle residues remaining after polishing may affect device yield and reliability. Stable colloidal silica systems help reduce particle agglomeration and contribute to easier post-CMP cleaning.
4
Customized Formulations Available：Particle size distribution, solid content, pH value and packaging specifications can be customized according to different process requirements.
5
CMP Slurry Supplier and Manufacturer：As a professional CMP slurry supplier and manufacturer, we provide customized colloidal silica polishing slurry solutions for semiconductor wafer planarization and advanced material polishing applications.
6
Easy Post-Polishing Cleaning： Stable slurry systems help reduce residue adhesion on wafer surfaces, improving cleaning efficiency after CMP processing.
7
Flexible Dilution Capability： The slurry can be adjusted with deionized water depending on process requirements, providing flexibility for different polishing conditions.
3D Structured Film (Cleaning belt for LCD panels)Flocked Pile Polishing Film for Roller Finishing and LCD Wiping
Polishing tape for repair defects and flatten protrusion points in LCD color filter process
PSA Film Disc Roll for Fine Sanding and Finish of Automotive Coatings
Electrostatic Coated Microfinishing Film Roll for Ultra-Fine Surface Finishing
Precision Coated Diamond Roll for Fiber Optic & Microfinishing
